By news@appleinsider.com (William Gallagher) The iPhone 17 range may not utilize the rumored thinner motherboard after all. It would have reduced costs and also increased available space for other components.A motherboard or mainboard (source: Ming-Chi Kuo)Analyst Ming-Chi Kuo broke the news of Apple working on this new motherboard in October 2023. It was to use Resin Coated Copper (RCC), which replaces the traditional bonding sheet — the familiar green backing of a motherboard — with a deposited resin.At the time, Kuo said that this would not only save internal space in the iPhone 17 but “because it’s fiberglass-free” would also make the required drilling easier. That in itself would cut down on production costs. Rumor Score: 🤔 Possible Continue Reading on AppleInsider | Discuss on our Forums

Source:: Apple Insider